Conf42 Golang 2025 - Online

- premiere 5PM GMT

Unlocking the Future of Power Efficiency in Semiconductor Design with Backside Power Delivery

Abstract

Backside Power Delivery Networks (BSPDN) are transforming semiconductor design! Discover how advanced nano-Through Silicon Vias (nTSVs) enhance performance, reduce power use, and unlock the future of high-performance computing, offering improved power efficiency and design flexibility.

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Ramalinga Reddy Kotapati

Technical Lead Physical Design Engineer @ Intel Corporation

Ramalinga Reddy Kotapati's LinkedIn account



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